During the production of PIR and PU panels depending on the thickness of panels, heat would be generated due to chemical reactions. In the case of PIR and thicker PU panels, products must be cooled down to room temperature
in order to avoid defects in the final products. Cooling device is designed in a way that takes the panels after cutting and
delays their arrival for stacking and packing. The speed of cooling could be adjusted as required.
This process is designed to pack panel bondless by use of PVC stretch wraps before final delivery.
This machine is specially designed for embossing aluminum foils with the thickness of lower than 0.1mm. The use of aluminum foils or other materials with thickness exceeding 0.2mm is not recommended.